IEEE IUS 2021 Patrons & Supporters
Special Thanks
The conference organizers gratefully acknowledge the generous support provided by the following
Verasonics designs and markets leading-edge Vantage™ ultrasound research systems for academic and commercial investigators. These real-time, software-based, programmable ultrasound systems accelerate research by providing unsurpassed speed and control to simplify the data collection and analysis process. Researchers in 34 countries routinely use the unparalleled flexibility of the Vantage platform to advance the art and science of ultrasound through their own research efforts. In addition, to protect your investment and encompass additional research options, every Vantage System can be upgraded to any configuration. Verasonics’ Vantage Systems are the ideal solution for ultrasound driven research and development in biomedical, materials science, earth sciences, and the physics of acoustics.
FUJIFILM VisualSonics, Inc is the undisputed world leader in the development of real-time ultrasound and photoacoustic systems, providing tools specifically designed to support imaging-based research. Our cutting edge technologies support researchers at the world’s top pharmaceutical and biotechnology companies, hospitals, and universities in their research efforts across areas including cardiovascular, cancer, neurobiology, developmental biology, and acoustics. These technologies support applications including genetic research, phenotypic studies, drug development, imaging systems development, and many more. VisualSonics' platforms combine a broad range of frequencies, high resolution, real-time data acquisition, and access to quantifiable data, all supported by powerful user-friendly software.
scia Systems is a full range supplier of advanced ion beam and plasma processing equipment. The systems are applicable for etching (e.g., delayering of dies), trimming (e.g., surface correction of filter devices) and coating (e.g., temperature compensation films) processes in the production of microelectronics and MEMS.
Our process equipment achieves Angstrom precision in frequency, surface and thickness trimming, in manufacturing of BAW and SAW devices. The industry proven scia Trim 200, enables ion beam trimming of functional layers in compound wafers, which leads to excellent material properties.
Due to their flexible and modular design, the systems can be configured according to customer specific requirements for both, high volume production as well as research and development environments. Together with our worldwide service partners, we offer comprehensive service and superior technology support.
scia Systems is a full range supplier of advanced ion beam and plasma processing equipment. The systems are applicable for etching (e.g., delayering of dies), trimming (e.g., surface correction of filter devices) and coating (e.g., temperature compensation films) processes in the production of microelectronics and MEMS.
Our industry proven equipment achieves Angstrom precision in frequency, surface and thickness trimming, in manufacturing of BAW or SAW devices and enables ion beam trimming of functional layers in compound wafers, which leads to excellent material properties.
Due to their flexible and modular design, the systems can be configured according to customer specific requirements for both, high volume production as well as research and development environments. Together with our worldwide service partners, we offer comprehensive service and superior technology support.
